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Cheers guys. I've just had a read of the relevant section of GN8 but it didn't offer any reasoning behind the 8.5 factor and the difference between a CPC and bonding conductor in terms of copper equivalency.
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A CPC's size is based on the temperature rise in the time it takes the ocpd to operate when a particular fault current flow. So this is looking at the ability of the conductor to survive a high current for a short length of time.
Bonding is sized considering its ability to safely handle a sustained flow of current.
Also it's worth noting that the table you linked to above is incorrect and has been for many many years.